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金刚石铜复合材料具有高导热率和低膨胀系数,在微电子领域用作Ga N和Si C等高功率芯片的散热热沉,可以显著降低大功率芯片的结温,提高电子产品的可靠性和寿命。通过在金刚石铜复合材料表面上化学镀镍金的方法使表面金属化以改善其焊接性。未做处理的金刚石表面非常光滑,难以和其他金属附着,由于金刚石性质非常稳定,不容易被强酸和强碱表面处理,铜较活泼,采用一般处理方法容易使铜处理过度,而金刚石没反应。对比采用了硝酸、硫酸、氢氧化纳、喷砂、人工打磨等多种方法对金刚石铜表面前处理,效果有限。根据金刚石铜材料特性采用JG-01金刚石铜粗化处理液,能够有效对金刚石进行粗化处理,且对铜无损伤,在金刚石表面形成了连续的蜂窝状微孔,提升金刚石表面镀涂结合力。金刚石铜粗化后通过活化、敏化、化学镍、镀金等镀涂工艺,镍金镀层附着力满足军标热震试验、高温烘烤要求,镀金层覆盖率达到100%,镀层粗糙度显著降低,镀层对金锡和锡铅焊料的可焊性满足产品使用要求。
Diamond copper composites with high thermal conductivity and low expansion coefficient, in the field of microelectronics for Ga N and Si C and other high-power chip heat sink, can significantly reduce the high-power chip junction temperature and improve the reliability of electronic products and life. The surface is metallized to improve its weldability by a method of electroless nickel plating on the surface of a diamond copper composite. Unprocessed diamond surface is very smooth and difficult to attach to other metals. Due to the very stable nature of the diamond, it is not easy to be surface treated with strong acids and bases, copper is more lively, copper is easily overhauled by the usual methods, and the diamond does not react. Compared with nitric acid, sulfuric acid, sodium hydroxide, sandblasting, artificial grinding and other methods on the surface of diamond copper pretreatment, the effect is limited. According to the characteristics of diamond copper material using JG-01 diamond copper roughening liquid, the diamond can be effectively roughened, and no damage to copper, the diamond surface formed a continuous honeycomb microporous, diamond plating surface to enhance adhesion . The sensitization, chemical nickel, gold plating and other coating processes after the diamond copper is roughened. The adhesion of the nickel gold coating meets the military standard thermal shock test and the baking requirements of high temperature are achieved. The coverage of the gold plating layer reaches 100% and the coating roughness is significantly reduced , The coating of gold tin and tin-lead solder solderability to meet product requirements.