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引言等离子体增强化学气相沉积(PECVD或PACVD简称PCVD),作为沉积超硬膜的一种新工艺,已引起人们的极大关注。在PCVD过程中,由于电子能量(大约为1～10eV)远高于气体能量,温度(相当于10~4～10~5K)远高于气体温度(在10~3K以下),由分子热运动产生的非弹性碰撞很少,因此主要是高能电子与气体分子的非弹性碰撞,从而可提高气体分子内能,并引起激发、分解和电离,使化合物的分解或化合所需要的能量和反应温度降低;强化2TiCl_4+4H_2+N_2→2TiN+8HCl↑反应,在500℃左右,就可获得TiN覆层。
Introduction Plasma Enhanced Chemical Vapor Deposition (PECVD or PACVD referred to as PCVD), as a new technology for deposition superhard film, has caused great concern. In the PCVD process, the temperature (equivalent to 10 ~ 4 ~ 10 ~ 5K) is much higher than the gas temperature (under 10 ~ 3K) because of the much higher electron energy (about 1 ~ 10eV) Resulting in a small non-elastic collision, it is mainly non-elastic collision of high-energy electrons and gas molecules, which can increase the internal energy of gas molecules, and cause excitation, decomposition and ionization, the compound required for decomposition or chemical energy and reaction temperature Reduce; strengthening 2TiCl_4 + 4H_2 + N_2 → 2TiN + 8HCl ↑ reaction, at about 500 ℃, you can get TiN coating.