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探索了一种通过MEMS技术制备硅基微穿孔板共振降噪结构,并进一步将ZnO微米纳米材料加入其中以提高吸声性能的新方法.采用MEMS技术在硅片上得到了孔径为100μm、一致性良好的微孔阵列,将其与刚性底座组合在一起,构成硅基微穿孔板降噪器件.将通过水热合成法得到的ZnO微米纳米材料制备在后底板硅片上,并与硅基微穿孔板组装在一起,构成微米纳米复合降噪器件.对上述两种器件进行降噪实验,结果显示采用MEMS精密加工技术能够获得吸声系数较高的共振降噪器件,而经过ZnO微米纳米材料修饰后的复合器件,其在1 500～6 000Hz频段内的平均吸声系数提高了2.54%,达到85.87%.这一现象在1 500～3 000 Hz频段尤为明显.因而,采用ZnO微米纳米材料修饰后的复合器件,吸声性能有所提升.
A new method to fabricate the resonant noise reduction structure of Si-based micro-perforated plate by MEMS technology and to further add the ZnO micro-nano-material to improve the sound absorption performance was obtained.The MEMS technology was used to obtain a 100μm pore size Good micropore array, combined with a rigid base to form a silicon-based micro-perforated plate noise reduction device ZnO nanomaterials obtained by hydrothermal synthesis prepared on the backplane silicon wafer, and the silicon base Micro-perforated plate assembled together to form a nano-composite micron noise reduction devices.Non-noise reduction experiments on the two devices, the results show that using MEMS precision processing technology to obtain high noise absorption coefficient of the resonant noise reduction device, and after ZnO micro-nano The average absorption coefficient of the modified composite device increased by 2.54% to 85.87% in the frequency band from 1 500 to 6 000 Hz, which is especially evident in the frequency band from 1 500 to 3 000 Hz.Thus, ZnO micro-nano Materials modified composite devices, acoustic performance has improved.