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据统计,我国现有4″—8″IC 芯片制造线30条,在建和拟建的 IC 芯片制造线36条。由于我国集成电路制造业发展较快,而半导体设备制造业却未能同步发展,特别是前道微细加工设备(如曝光、刻蚀、掺杂、薄膜生长等工艺加工设备),目前绝大部分依旧依靠进口。为了尽快改善这一局面,促进我国专用设备与仪器的发展,国家在政策和资金投入上大力扶植该产业的发展,我国半导体专用设备业正面临着前所未有的机遇和挑战。我国半导体设备产业的现状我国半导体专用设备制造业自60年代初开始起步,研制出生产半导体分立器件,如二、三极管的烧结炉、点焊机、封帽机、切割机等生产设备。60年代末、70年代初我国 IC 生产企业纷纷上马,专用设备因受到高度重视而得到较快的发展,(?)50mm、(?)75mm 半导
According to statistics, there are 30 manufacturing lines for 4 “-8” IC chips in China and 36 manufacturing lines for IC chips under construction and to be built. Due to the rapid development of IC manufacturing industry in our country, the semiconductor equipment manufacturing industry has not been able to develop simultaneously. In particular, most micro-processing equipment (such as exposure, etching, doping and thin film growth) Still rely on imports. In order to improve this situation as soon as possible and promote the development of special equipment and instruments in our country, the state vigorously supports the development of this industry in terms of policies and capital investment. China’s semiconductor equipment industry is facing unprecedented opportunities and challenges. China’s semiconductor equipment industry status quo China’s semiconductor equipment manufacturing industry has started since the early 60s, developed the production of semiconductor discrete devices, such as two, transistor sintering furnace, spot welding machine, sealing cap machine, cutting machine and other production equipment. In the late 1960s and early 1970s, China’s IC manufacturing enterprises have been launched one after another, special equipment due to the rapid development of highly valued, (?) 50mm, (?) 75mm semiconductor