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建立了面向复杂光学表面的大气等离子抛光系统,并用该系统进行硅片表面加工的实验研究。研究了CF4、SF6两种气体的放电特性以及加工效果,得到了加工速率与功率,流量间的关系,并通过原子力显微镜观察了加工后的表面质量。
The atmospheric plasma polishing system for complex optical surfaces was established and the experimental research on the surface processing of silicon wafers was carried out by this system. The discharge characteristics and processing effects of CF4 and SF6 gas were studied. The relationship between processing rate and power and flow rate was obtained. The surface quality after processing was observed by atomic force microscopy.