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采用一种测定氧化膜生长应力的双面氧化弯曲方法，测量了Fe-23Cr-5Al(Fe-22.6Cr-4.42Al-0.21Ti,wt%）合金在1000℃空气中氧化形成的Al2O3膜的平均生长应力，研究了氧化膜应力释放机制。Al2O3膜的平均生长应力随膜厚增大而减小，其大小从-1GPa数量级变化到-100MPa数量级。基体合金和Al2O3膜在1000℃时均发生蠕变。合金氧化一定时间后于真空保温退火，发现0.039μm厚的氧化膜应力下降速率比0.30μm厚的氧化膜快6.9~18.4倍.
The average oxidation rate of Al2O3 film formed by oxidation of Fe-23Cr-5Al (Fe-22.6Cr-4.42Al-0.21Ti, wt%) alloy in air at 1000 ℃ was measured by a double- Growth stress, the stress relaxation mechanism of the oxide film was studied. The average growth stress of Al2O3 films decreases with the increase of film thickness, and the size changes from -1GPa to -100MPa. The matrix alloy and Al2O3 film all creep at 1000 ℃. After the alloy was annealed in a vacuum for a certain period of time, it was found that the rate of stress drop of the 0.039 μm thick oxide film was 6.9 to 18.4 times faster than that of the 0.30 μm thick oxide film.