太赫兹频段部件的工艺实现是决定器件性能的关键环节。从太赫兹频段部件用50μm超薄石英基片薄膜电路的集成工艺技术难点和可实现性出发,重点介绍了一种灵活快速的解决方案——临时键合与解键合技术。结果表明,临时键合与解键合技术克服了超薄石英基片脆性大、易破碎的弊端,在50μm及以下厚度超薄石英基片薄膜电路集成中具有很好的应用前景。 Terahertz frequency band components of the process is to determine the performance of the key components. Starting from the technical difficulties and achievability of terahertz frequency band components integrated with 50μm ultrathin quartz substrate thin film circuits, a flexible and rapid solution - temporary bonding and solution bonding technology is mainly introduced. The results show that the temporary bonding and solution bonding technology overcomes the shortcomings of brittleness and fragility of the ultrathin quartz substrate and has good application prospect in the integration of the thin film circuit of the ultrathin quartz substrate with the thickness of 50μm and below.