利用有限元方法,仿真分析了深反应离子刻蚀工艺造成的折叠梁宽度误差对电容式微加速度计温度漂移的影响。在存在工艺误差和保证微加速度计灵敏度恒定的前提下,增大了折叠梁设计宽度,计算了不同宽度下微加速度计的温度漂移量。结果表明:刻蚀工艺误差越大,微加速度计温度漂移量越大。折叠梁设计宽度为4.5μm和6.5μm时,最大温度漂移量分别为2.42mg/℃和1.71mg/℃,因此通过适当地增大设计尺寸,可以有效地减小微加速度计的温度漂移量。 The finite element method is used to simulate and analyze the influence of folding beam width error on the temperature drift of capacitive micro-accelerometer caused by deep reactive ion etching process. Under the premise of the process error and the constant sensitivity of the micro-accelerometer, the design width of the folded beam is increased and the temperature drift of the micro-accelerometer with different widths is calculated. The results show that the larger the error of etching process, the larger the temperature drift of micro-accelerometer. When the design widths of the folded beams are 4.5μm and 6.5μm, the maximum temperature drift amounts to 2.42mg / ℃ and 1.71mg / ℃ respectively. Therefore, the temperature drift of the micro-accelerometer can be effectively reduced by appropriately increasing the design dimension.