组装材料是进行表面组装工艺的基础。不同的组装工序采用不同的组装材料。有时在同一组装工序中,由于后续工艺或组装方式不同,所用材料也有所不同。在采用波峰焊接的场合,组装时用粘接剂把元器件预固定在P C B上。在PCB两面都组装SMD时,即使采用再流焊接,PCB上焊盘图形中央也要 Assembly materials are the basis for the surface assembly process. Different assembly processes using different assembly materials. Sometimes the same assembly process, due to the follow-up process or assembly methods, the materials used are also different. In the case of wave soldering, the components are pre-fixed on P C B with adhesive during assembly. When the SMD is assembled on both sides of the PCB, the center of the pad pattern on the PCB is required even with reflow soldering