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通过堆栈电子器件的三维集成电路(3D-ICs)能够缩小封装面积,并增加系统的容量和功能。在过去的几十年中,基于薄晶圆(通常厚度小于100μm)的硅穿孔(Through-Silicon Via,TSV)技术已经实现了3D-IC封装。但是由于薄晶圆的易碎性和易翘曲的倾向,在对器件晶圆进行背部加工过程中,需要利用胶粘剂将其固定在载体上,并使薄晶圆在背部加工后易于从载体上剥离。文章介绍了用于此工艺的临时键合胶的研究现状,并对一种新型的、基于热塑性树脂的临时键合胶性能进行了系统的考察。这种新型的胶粘剂表现出优异的流变性能、热稳定性、化学稳定性和足够的粘接强度,并且易于剥离和清洗。这些研究成果拓展了可以应用于临时键合胶的聚合物范围,对促进TSV技术的应用具有重要意义。
By stacking 3D electronic devices integrated circuits (3D-ICs) can reduce the package area, and increase system capacity and functionality. In the past few decades, 3D-IC packages have been implemented based on Through-Silicon Via (TSV) technology of thin wafers (typically less than 100 μm in thickness). However, due to the fragility and warpage tendency of thin wafers, it is necessary to fix the wafers to the carrier with an adhesive during backside processing of the device wafers, and to allow the thin wafers to be easily removed from the carrier after being processed back Peel off. This paper introduces the research status of the temporary bonding glue used in this process and systematically investigates the properties of a new type of temporary bonding adhesive based on the thermoplastic resin. This new adhesive exhibits excellent rheology, thermal stability, chemical stability and sufficient bond strength, and is easy to peel and clean. These findings have broadened the range of polymers that can be applied to temporary bonding compounds and are of great importance in promoting the application of TSV technology.