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采用Zr箔/Cu箔/Zr箔中间层对Ti(C,N)-Al2O3陶瓷基复合材料进行部分瞬间液相扩散连接实验,研究保温时间对元素扩散及界面反应产物的影响,探讨了制约接头室温强度的因素,对比分析了在部分瞬间液相扩散连接过程中,辅助脉冲电流对元素扩散及接头强度的作用机制.结果表明,预置Zr箔/Cu箔/Zr箔中间层通过部分瞬间液相扩散连接,在加热温度950℃,保温时间15~30 min条件下接头强度达到最大值.保温时间过短,活性元素Zr削弱基体强度,保温时间过长,Zr与Cu在界面生成金属间化合物降低了接头的强度.扩散焊过程中施加辅助脉冲电流能够有效缓解接头的残余应力,防止裂纹在脆性基体材料中扩展;但是同时促进了界面处的反应进程,显著提高了界面处Cu-Zr金属间化合物的形成速度,使得界面易成为接头的薄弱环节.
Partially transient liquid phase diffusion bonding experiments of Ti (C, N) -Al2O3 ceramic matrix composites with Zr foil / Cu foil / Zr foil interlayer were carried out to study the effect of holding time on element diffusion and interfacial reaction products. The mechanism of auxiliary pulse current on the element diffusion and the strength of the joint during the transient liquid phase diffusion bonding was analyzed.The results showed that the interfacial tension of the Zr foil / Phase diffusion bonding, the joint strength reaches the maximum under the conditions of heating temperature of 950 ℃ and holding time of 15 ~ 30 min.The holding time is too short, the active element Zr weakens the matrix strength and the holding time is too long, and the intermetallic compound Which reduces the strength of the joint.The application of auxiliary pulse current during diffusion welding can effectively relieve the residual stress of the joint and prevent the crack from expanding in the brittle matrix material, but at the same time, the reaction process at the interface is promoted and the Cu-Zr metal Inter-compound formation rate, making the interface easy to become the weak link.