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用电沉积方法制备了含钨1.76%(质量分数)的Ni-W合金药型罩。通过拉伸试验对原始电铸态和热处理后样品的力学性能进行了评价,并利用X射线衍射、透射电子显微镜、俄歇电子能谱等技术对原始电铸态和热处理后样品的微观结构进行了分析。结果表明,通过电铸技术制备的Ni-W合金药型罩材料强度较高,晶粒细小并具有(111)织构。制备的Ni-W合金仍具有面心立方结构,W固溶在Ni的晶格中。Ni-W合金药型罩材料经300℃退火后,晶粒发生异常长大,(111)织构转变为(220)织构。经500℃退火后,由于硫在晶界的偏析,发生沿晶断裂,严重影响了材料的力学性能。
Electrodeposition method was used to prepare a 1.76% (mass fraction) tungsten alloy Ni-W cover. The mechanical properties of the samples after the primary electroforming and heat treatment were evaluated by tensile test. The microstructures of the samples after the primary electroforming and heat treatment were characterized by X-ray diffraction, transmission electron microscopy and Auger electron spectroscopy Analysis. The results show that the electroplated Ni-W alloy coated material has high strength, fine grains and (111) texture. The prepared Ni-W alloy still has a face-centered cubic structure, and W dissolves in the lattice of Ni. Ni-W alloy drug-type cover material annealed at 300 ℃, the grain abnormal growth, (111) texture into (220) texture. After 500 ℃ annealing, due to the segregation of sulfur in the grain boundaries, the occurrence of intergranular fracture, severely affected the mechanical properties of the material.