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利用SEM /EDX、XPS及X射线粉末衍射手段 ,对CVDBN陶瓷与金属 (无氧铜、钛 )的接合机理进行了分析 ,并用反应自由焓函数法对CVDBN陶瓷与金属的界面反应作了热力学计算。结论认为CVDBN陶瓷对无氧铜、钛的气密接合主要依靠活性焊料与CVDBN陶瓷表面层间的相互扩散及反应
The bonding mechanism between CVDBN ceramic and metal (oxygen-free copper, titanium) was analyzed by SEM / EDX, XPS and X-ray powder diffraction. The interface reaction between CVDBN ceramic and metal was calculated by free enthalpy function method. . It is concluded that the gas-tight bonding of CVDBN to oxygen-free copper and titanium mainly depends on the interdiffusion and reaction between the active solder and CVDBN ceramic surface layer