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一、前言最近随着超LSI研制工作的进展,亚微米加工技术引起了人们的普遍重视。从目前看,用于电子计算机的LSI,每片上的器件数比以前增加了2倍,今后还将继续增加。按这种增加速度到1980年,每一芯片上的器件数将达到10~6甚至超过10~7个。要把这样大数量的器件高密度地集成在一个芯片上,就要扩大芯片面积同时器件自身也需要进一步微细化,这样就要进行亚微加工。另外光1C,表面波器件,磁泡器件,超高频晶体管等也需采用微加工技术。
First, the foreword Recently, with the progress of research and development of super LSI, submicron processing technology has caused people’s universal attention. At the moment, LSIs used in electronic computers have doubled the number of devices per chip, and will continue to increase in the future. By this rate of increase to 1980, the number of devices on each chip will reach 10 to 6 or even more than 10 to 7. To integrate such a large number of devices in a single chip, it is necessary to expand the chip area and at the same time, the device itself needs to be further miniaturized, so that submicron processing is required. In addition light 1C, surface wave devices, bubble devices, ultra-high frequency transistors, etc. also need to use micro-processing technology.