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近年来,随着对功率的需求越来越高,PCB板的散热设计变得更为关键。本文以几个实例论述了MOSFET封装如何改善整个电路板的温度,使其在期望的范围之内。除了DC总线转换器(可达220W级别),本文还讨论了在控制和同步FET插座内带有不同MOSFET的同步降压转换器。对不同设备的相关性能进行了比较。通过测试同步降压转换器和DC总线转换器,发现并联MOSFET并不像期望的那样会降低电路板的温度。优化DC总线转换器会得到比较好的效果,这说明每个插座中的单个设备只有具备良好的Rdson和散热性能,才能达到最佳的整体性能。
In recent years, as the demand for power is getting higher and higher, PCB thermal design becomes more critical. This article discusses several examples of how the MOSFET package improves the temperature of the entire board to within the desired range. In addition to the DC bus converter (up to 220W), this article also discusses synchronous buck converters with different MOSFETs in control and synchronous FET sockets. The relative performance of different devices were compared. By testing synchronous buck converters and DC bus converters, it was found that parallel MOSFETs did not reduce the board temperature as expected. Optimizing the DC bus converter yields better results, indicating that only a single device in each outlet has good Rdson and thermal performance for the best overall performance.