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采用固溶时效热处理对电脉冲处理后的HSi59-2.5硅黄铜进行了软化处理,分析了电脉冲处理硅黄铜中β相与γ相的转变特点,探究了这种变化与基体硬度及合金切削性能的关系。结果表明,在相同固溶处理条件下,电脉冲处理使硅黄铜中γ相数量减少,β/γ溶解度曲线随合金元素Zn含量变化更趋平缓,导致Cu-Zn相图中β相区向右扩大。随固溶温度降低,电脉冲处理硅黄铜组织中的γ相增加,且分布均匀;随着时效温度的降低,γ相析出数量逐渐减小。电脉冲处理硅黄铜热处理后的显微硬度均较未处理的有明显降低。
The softening treatment of HSi59-2.5 silicon brass after electric pulse treatment was carried out by solution heat treatment. The transformation characteristics of β phase and γ phase in silicon brass treated by electric pulse were analyzed. And the relationship between hardness and alloy hardness Cutting performance relationship. The results show that under the same solution treatment conditions, the number of γ phases in silicon brass decreases with the electric pulse treatment, and the β / γ solubility curves change more smoothly with the Zn content of the alloying elements, resulting in the β phase orientation in the Cu-Zn phase diagram Right to enlarge. With the decrease of solution temperature, the γ phase in silicon brass increases with electrical pulse and distributes uniformly. With the aging temperature decreases, the amount of γ phase precipitates decreases. The microhardness of silicon brass after electric pulse treatment is obviously lower than that of untreated silicon brass.