论文部分内容阅读
随着IC集成度增高,线宽缩小及保证器件的可靠性,对高纯水中微量杂质和颗粒等提出了更高的要求。如何做到既保证清洗质量又节约高纯水,是每个半导体器件厂关心的问题。本厂开发的硅片清洗终点检测仪可在清洗过程中连续检测硅片及其它材料清洗的洁净度。仪器主要特点是:清洗容器和进水连接管道全部用石英制成。采用纯钛电导电极测量进水及出水的电阻率。仪器上的表头可直接读出进水电阻率(一般在25℃时为8～18MΩ),进水流置为6±l|/min,工作电压为土6V,污染度检测范围为0～8度(清洗器空载污染度<1度),清洗硅片尺寸为φ50mm,进水温度为10～40℃工作原理:在清洗器的进、出水管道中各安装一只同轴
With the increase of IC integration, narrowing of line width and ensuring the reliability of devices, higher requirements are put forward on trace impurities and particles in high-purity water. How to do both to ensure the quality of cleaning and save high-purity water, is the concern of each semiconductor device factory. Our factory developed wafer cleaning end detector can continuously check the cleanliness of silicon and other materials in the cleaning process. The main features of the instrument are: cleaning container and water connection pipe all made of quartz. Using pure titanium conductive electrode measuring water and water resistivity. Instrument header can directly read the water resistivity (generally at 25 ℃ for 8 ~ 18MΩ), inflow set to 6 ± l | / min, the working voltage of soil 6V, pollution detection range of 0 to 8 Degree (Cleaner no-load pollution degree <1 degree), the cleaning silicon size is φ50mm, the water temperature is 10 ~ 40 ℃ Working principle: In the cleaning of the inlet and outlet pipes to install a coaxial