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文章介绍了一种具有潜在经济效益的新技术,该技术结合大气压下介质阻挡放电图形处理方法(文章中称为“等离子印刷”)和“电流电镀”的方法,该技术可以用于FPC的生产。该技术由行业界和学术界联合研究开发,主要是为了实现卷对卷(Reel-to-Reel)的生产工艺。至今为止,等离子印刷试验都是在实验室的设备上进行。因此,使用合适的等离子条件和化学镀镀液,能够生产线宽和间距达100μm的类似于RFID的标签和交叉指型的结构。经过剥离强度试验测定,由介质阻挡放电处理过的聚酰亚胺与铜箔的粘合强度可以达到大约1N/mm,类似DIN 53494中的描述。
This article describes a potentially cost-effective new technology that incorporates methods of dielectric barrier discharge patterning (referred to as “plasma printing”) and “current plating” at atmospheric pressure that can be used In the FPC production. The technology by the industry and academia jointly research and development, mainly to achieve the reel-to-reel (Reel-to-Reel) production process. To date, plasma printing tests have been performed on laboratory equipment. Therefore, using appropriate plasma conditions and electroless plating baths, it is possible to produce RFID-like labels and interdigital structures with line widths and spacings up to 100 μm. After peel strength test, the adhesion strength of dielectric barrier discharge treated polyimide to copper foil can reach about 1 N / mm, similar to that described in DIN 53494.