通过大量实验数据及图表论述了化学镀ＮｉＣｕＰ的工艺条件，探讨了镀液的主要组成、镀液的ｐＨ 值、施镀时间对镀层中Ｎｉ、Ｃｕ 、Ｐ含量及镀层的沉积速度的影响，总结了随工艺参数变化镀层成分变化的趋势及规律。文中还简述化学镀ＮｉＣｕＰ镀层成分与组织结构的关系。 Through a large number of experimental data and charts discussed the process conditions of electroless Ni-Cu-P electroless plating, discussed the main composition of the bath, the bath pH value, plating time on the coating Ni, Cu, P content and coating deposition rate The influence and trend of the change of coating composition with the process parameters are summarized. The article also briefly described the electroless Ni-Cu-P coating composition and structure of the relationship.