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研究了微米Ag颗粒对Sn-0.7Cu钎料焊点组织和性能的影响规律。研究结果表明:在Sn-0.7Cu中加入适量的Ag可以改善钎料的润湿性,但是当加入的Ag含量过高,反而会降低钎料的润湿性。当Ag含量为1%时,润湿性最好,铺展系数K为72.09%。增加Ag含量利于促进β-Sn/Cu6Sn5网状共晶组织的生成和非均匀形核反应的进行,细化β-Sn晶粒。当Ag含量为1%时,钎料焊点的抗拉强度最好,达到47.85 MPa。当Ag含量超过2%时,随着IMC层厚度的增加,焊点的抗拉强度逐渐降低。综合考虑,当Ag含量为1%时,钎料焊点的综合性能最好。
The influence of micron Ag particles on the microstructure and properties of Sn-0.7Cu solder joints was investigated. The results show that adding appropriate amount of Ag into Sn-0.7Cu can improve the wettability of solder, but when the content of Ag is too high, the wettability of solder will be reduced. When the content of Ag is 1%, the wettability is the best, and the spreading coefficient K is 72.09%. Increasing the Ag content is conducive to promoting the formation of β-Sn / Cu6Sn5 reticular eutectic structure and the heterogeneous nucleation reaction, and refining the β-Sn crystal grain. When the content of Ag is 1%, the solder joint has the best tensile strength, reaching 47.85 MPa. When the content of Ag exceeds 2%, the tensile strength of the solder joint gradually decreases with the increase of the thickness of IMC layer. Taken together, when the Ag content of 1%, the overall solder joint performance best.