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应用矩形缝隙模拟装置,研究Q235钢在土壤浸出液中有无硫酸盐还原菌条件下,缝隙厚度为0.5mm时的缝隙腐蚀行为。电化学阻抗谱测试结果表明,随着实验时间的延长,Q235钢在有菌溶液中的容抗弧半径小于相同时期在无菌溶液中的容抗弧;Q235钢在有菌溶液中的腐蚀速率大于无菌溶液。硫酸盐还原菌促进了Q235钢在溶液中的腐蚀。同一时期,随着缝口距离的增加,有菌溶液及无菌溶液中的容抗弧都先增大后减小,其中在有菌溶液中的容抗弧较小,腐蚀速率比无菌溶液中的大。
The rectangular crack simulator was used to study the crevice corrosion behavior of Q235 steel in the presence of sulphate-reducing bacteria in soil leachate at a crevice thickness of 0.5 mm. The results of electrochemical impedance spectroscopy showed that the capacitive arc radius of Q235 steel in bacteria solution was less than that of the same period in sterile solution with the extension of experimental time. The corrosion rate of Q235 steel in bacteria solution Greater than sterile solution. Sulfate reducing bacteria promote the corrosion of Q235 steel in solution. During the same period, with the increase of the sewing distance, the capacitance arcs in both the bacteria solution and the sterile solution first increased and then decreased, and the capacitance arc in the bacteria solution was smaller and the corrosion rate was faster than that in the sterile solution In the big.