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赛灵思公司(Xilinx+)日前宣布,其16nm UltraScale+TM系列FPGA、3DIC和MPSoC凭借新型存储器、3D-on-3D和多处理SoC(MPSoC)技术,再次实现了领先的价值优势。此外,为实现更高的性能和集成度,UltraScale+系列还采用了全新的互联优化技术——SmartConnect。这些新的器件进一步扩展了赛灵思的Ultra Scale产品系列(现从20nm跨越至16nm FPGA、So C和3D IC器件),同时利用台积电公司的16FF+Fin FET 3D晶体管技
Xilinx + announced today that its 16nm UltraScale + TM family of FPGAs, 3DICs and MPSCs have once again achieved leading value benefits with new memory, 3D-on-3D and multiprocessing SoC (MPSoC) technologies. In addition, for greater performance and integration, the UltraScale + family also features the new Internet of Things optimization technology, SmartConnect. These new devices further expand Xilinx’s Ultra Scale product family (now spanning 20nm to 16nm FPGAs, So C and 3D IC devices) while utilizing TSMC’s 16FF + Fin FET 3D transistor technology