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中芯国际集成电路制造有限公司(SMIC)和重庆重邮信科开发的第三代移动通信手机(3G手机)专用0.13 μm芯片一举测试成功,这是国内迄今为止手机芯片生产所采用的最先进的工艺。目前,国内公司大多都在开发基于0.18 μm工艺的3G手机。国产3G技术TD-SCDMA目前已具备大规模独立组网能力, 专用芯片的研发成功为TD-SCDMA双模手机的生产迈出了坚实的一步,此举标志着重庆重邮信科在国内首家成功开发出基于0.13 μm工艺的3G手机芯片设计技术。
The 0.13-μm chip for the third-generation mobile handsets (3G handsets) developed by SMIC and Chongqing Chongyouxinke has been tested successfully in one fell swoop, which is the most advanced technology adopted by handsets in China so far Process. At present, most domestic companies are developing 3G handsets based on the 0.18 μm process. TD-SCDMA, a domestic 3G technology, now has large-scale independent networking capabilities. The successful development of dedicated chips has taken a solid step toward the production of TD-SCDMA dual-mode handsets, marking the first of its kind in Chongqing. Successfully developed 3G mobile phone chip design technology based on 0.13 μm process.