随着集成电路的不断发展,电路中互连线规模越来越大,尺寸越来越小,需要承受的电流密度越来越大。在这种趋势下,传统的铜互连线的有效性和可靠性都随之变差。由于碳纳米管具有良好的电学,热学和机械性能,使其成为目前研究较热的互连材料之一。本文概述了碳纳米管用于集成电路互连的优势,碳纳米管互连的电路模型,碳纳米管互连面临的挑战及其最新的研究进展,并展望了碳纳米管作为集成互连的研究前景。 With the continuous development of integrated circuits, interconnects in circuits are getting larger and larger, smaller and smaller, and the current densities to be borne are getting larger and larger. With this trend, the effectiveness and reliability of traditional copper interconnect lines have become worse. Due to their good electrical, thermal and mechanical properties, carbon nanotubes make them one of the hotter interconnects currently studied. This article outlines the advantages of carbon nanotubes for interconnecting integrated circuits, the circuit model for interconnecting carbon nanotubes, the challenges that carbon nanotubes interconnect and the recent advances in their research. We also look forward to the application of carbon nanotubes as integrated interconnects prospect.