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(三)热设计医疗电子仪器设备工作时所消耗的电能,绝大部分被转化成热能向周围散发,这将使机内温度升高,仪器设备可靠性下降。近年来,由于电子技术的迅速发展,设备的组装密度增大,有效散热面积减小,对热设计的研究便显得尤为重要。据资料介绍,国外航空电子设备,有20%的现场失效是由温度效应引起的。相当多的医疗电子仪器设备的失效是由于功率及电源半导体器件的过热烧毁而引起的。在“217日”手册中列出了14种主要电子元器件的失效数据,它中有8种元器件的失效率取决于温度,即微电子器件,分立半导体器件、电阻器、电容器、电感器、转动元件、
(C) thermal design Medical electronic equipment work consumed by the electricity, the vast majority are converted into heat to the surrounding distribution, which will make the machine temperature, the decline in the reliability of equipment. In recent years, due to the rapid development of electronic technology, equipment assembly density increases, the effective cooling area decreases, the thermal design of the study is particularly important. According to the information, there are 20% of field failures in foreign avionics caused by the temperature effect. The failure of a considerable number of medical electronic equipment is caused by overheating of power and power semiconductor devices. The “217 Day” handbook lists the failure data for 14 major electronic components. The failure rate of 8 of these components depends on the temperature, ie, microelectronic devices, discrete semiconductor devices, resistors, capacitors, inductors , Turning elements,