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采用SEM和TEM,对不同形变量及退火温度下的Cu-Nb微观复合线材的显微组织结构进行了分析,并对形变和退火试样进行了硬度测试.结果表明:随着形变量增大,材料界面密度及其增加速率逐渐增大.当材料结构达到纳米尺寸时(应变=24.8),界面密度及其增加速率显著增加,使得硬度及其增加速率明显增大,同时伴随有纳米Cu基体内部层错和旋转晶界的产生.退火过程中Cu基体的显微组织变化表现出明显的多尺度效应,其变化可分为3个阶段:微米及亚微米Cu基体先发生回复再结晶,而纳米Cu基体回复再结晶受到抑制;纳米Cu基体回复再结晶;Nb丝球化及长大.
The microstructure of Cu-Nb micro-composite wire under different amount of deformation and annealing temperature was analyzed by SEM and TEM, and the hardness and deformation of the sample were measured.The results show that with the increase of deformation , The interfacial density and the rate of increase gradually increase.When the structure reaches nanometer size (strain = 24.8), the interfacial density and its increasing rate increase obviously, which makes the hardness and its increasing rate increase obviously, accompanied by nano Cu matrix Internal layer fault and rotating grain boundary. The microstructure of Cu matrix shows obvious multiscale effect during annealing, and its variation can be divided into three stages: the Cu matrix of micron and sub-micron first recrystallizes, Nano-Cu matrix recovery recrystallization was inhibited; nano-Cu matrix recovery recrystallization; Nb spheroidization and growth.