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研究了等温时效对 ＳｎＡｇ／Ｃｕ表面贴装焊点微结构， Ｓｎ－Ｃｕ金属间化合物生长及其剪切强度的影响，并与常用的６２Ｓｎ３６Ｐｂ２Ａｇ／Ｃｕ焊点进行了比较，结果表明，在时效过程中， ＳｎＡｇ钎料以较小的反应速率与 Ｃｕ发生反应 ＳｎＡｇ焊点显示了较强的剪切强度并且其受时效的影响较 ＳｎＰｂＡｇ焊点要小
The effects of isothermal aging on the microstructure of SnAg / Cu solder joints and the growth and the shear strength of Sn-Cu intermetallic compounds were studied and compared with the common 62Sn36Pb2Ag / Cu solder joints. The results show that during the aging process , SnAg solder reacts with Cu at a small reaction rate. SnAg solder joints show strong shear strength and are less affected by aging than SnPbAg solder joints