论文部分内容阅读
为了解决平面抛光加工中提高精度和效率的难题,根据中性微粒在非均匀电场中可以产生介电泳效应,提出了一种可以提高抛光均匀性和效率的介电泳抛光方法.讨论了介电泳理论及抛光原理,运用COMSOL软件仿真分析了不同电极的电场线分布.仿真结果表明:圆环70~90mm电极形状的电场线分布最不均匀.进行了相应电极的加工试验,试验结果表明:使用圆环70~90mm电极时材料去除率最大,达到0.573mg/min,相比传统CMP提升了19.9%.使用圆Φ60mm电极形状,工件材料去除最均匀、抛光效率最高,2.5h可以将Φ76.2mm硅片全部抛亮,比传统CMP提高了3.6倍,且最终表面粗糙度为0.97nm.在实际加工中,圆Φ60mm电极形状最适合Φ76.2mm硅片的介电泳抛光.
In order to solve the problem of improving accuracy and efficiency in plane polishing, a dielectrophoresis method based on neutral particles can generate dielectrophoresis in non-uniform electric field, and a method of dielectrophoresis polishing which can improve the uniformity and efficiency of polishing is proposed. And the principle of polishing, the distribution of the electric field lines of different electrodes was simulated by COMSOL software.The simulation results show that the distribution of the electric field lines of the electrode with the shape of 70 ~ 90mm ring is the most inhomogeneous.The processing experiments of the corresponding electrodes are carried out.The results show that the electric field distribution The maximum material removal rate of 0.573mg / min for ring 70-90mm electrode is 19.9% higher than that of traditional CMP. The most uniform polishing material is obtained by using the Φ60mm electrode shape, the highest polishing efficiency, and the highest polishing efficiency for 2.5h. All polished, 3.6 times more than the traditional CMP, and the final surface roughness of 0.97nm.In the actual processing, circular Φ60mm electrode shape most suitable for Φ76.2mm dielectrophoresis polishing.