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聚酰亚胺树脂作为一类化学品早在1926年就已制得。它们作为一种在250℃以上仍保持其电气和机械特性的塑料绝缘体而应用于电子工业也是早已得到公认。Harada及其在日立(Hitachi)中央研究实验室的同事曾就聚酰亚胺异吲哚喹唑啉二酮(简称PIQ)提出了报告。PIQ可用作大规模集成电路(LSI)多层布线的绝缘层及最后的钝化涂层。R.Rubner和同事又报导了一种可以简化半导体工艺步骤的光敏聚
Polyimide resins have been made as early as 1926 as a class of chemicals. They have long been recognized for use in the electronics industry as a plastic insulator that retains its electrical and mechanical properties above 250 ° C. Harada and colleagues at Hitachi Central Research Laboratory have reported on polyimide isoindoloquinazolinediones (PIQs). PIQ can be used as insulation and final passivation coatings for multilayer wiring of LSIs. R. Rubner and colleagues report another photo-poly that simplifies semiconductor process steps