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根据芯片级高效冷却技术—射流雾化冷却技术的散热机理和模型,从理论和实验方面分析了入口压力对射流雾化冷却性能的影响。在理论方面,分析得入口压力会影响芯片的临界热流密度和散热效率。在实验方面,用芯片的表面温度作为衡量射流雾化冷却散热性能的评价标准,通过改变入口压力分析其对射流雾化冷却性能的影响。本文研究表明当冷却液流量一定时,入口压力增加会使得芯片表面温度会不断降低,即入口压力增大可提高射流雾化冷却散热性能。
According to the chip-level high-efficiency cooling technology-jet cooling mechanism and model, the influence of inlet pressure on jet cooling performance is analyzed theoretically and experimentally. In theory, analysis of the inlet pressure will affect the chip’s critical heat flux and heat dissipation efficiency. In the experiment, the surface temperature of the chip was taken as the evaluation standard to evaluate the cooling performance of the jet atomization cooling. The effect of jet cooling on the atomization cooling performance was analyzed by changing the inlet pressure. This study shows that when the coolant flow rate is constant, the inlet pressure will increase the chip surface temperature will continue to decrease, that is, the inlet pressure increases can enhance jet cooling spray cooling performance.