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多芯片封装（ＭＣＰ）正在成为器件封装的重要方式，这不只是为了满足高运行速度的要求，而且还为了提高系统的集成度。尤其当封装体积和重量成为关键性推动因素时，就更是如此。随着ＭＣＰ尺寸增大以适应系统集成度日益提高的要求，气密性封接变得非常昂贵，且从技术上来说，即使不是毫无可能，也是难以达到的。这就促使我们对各种用于非气密ＭＣＰ的密封剂进行评估。我们相信，密封剂是未来ＭＣＰ技术的关键性因素。这些技术包括单片和混合圆片规模的集成，以及可提供更高水平封装集成的三维ＭＣＰ集成。在这些先进的ＭＣＰ应用中，密封剂可提供“非气密可靠性”，此外，在与气密封装具有同等可靠性的情况下，它可降低成本，减轻重量，缩小体积。本文中，我们发表了一项密封剂的研究成果，即鉴定适合于ＭＣＰ应用的增强型硅酮材料，同时，我们将确定ＭＣＰ应用所需密封剂的性能和特点。然后，我们根据文献综述为筛选实验选择了六种类型的密封剂。今这些密封剂在８５℃和８５％的相对湿度下，加直流偏压和现场漏电流监控进行测试，一种改性硅酮密封剂（ＭＳＥ，Ｕ．Ｓ．Ｐａｔｅｎｔ４８８８２６６）被确认为最有希望的材料，并接受更进一步的研究。将用ＭＳＥ密封的实验样品与五种经选择的化学试剂接?
Multi-chip packaging (MCP) is becoming an important part of device packaging, not only to meet the high speed requirements, but also to improve system integration. This is even more so when package size and weight are the key drivers. As MCP sizes increase to meet the demands of increasing system integration, hermetic seals become very expensive and technically difficult, if not impossible, to be achieved. This prompted us to evaluate a variety of sealants for non-hermetic MCPs. We believe that sealants are a key factor in the future of MCP technology. These technologies include monolithic and hybrid wafer-scale integration, as well as 3D MCP integration that offers a higher level of package integration. In these advanced MCP applications, sealants provide “non-hermetic reliability” and, in the same reliability as hermetically sealed packages, reduce costs, reduce weight, and reduce size. In this article, we publish a study on sealants that identifies reinforced silicone materials suitable for MCP applications. We will also determine the performance and characteristics of sealants for MCP applications. We then selected six types of sealants for screening experiments based on literature review. Today these sealants were tested at 85 ° C and 85% relative humidity with DC bias and on-site leakage current monitoring. A modified silicone sealant (MSE, U.S. Patent 4,888,266) was identified as the most promising The material, and accept further research. Will MSE-sealed experimental samples be combined with five selected chemistries?