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随着科学技术的发展,尤其是电子工业的迅速发展,需要焊接导热率大,熔化温度高的金属。广泛应用在电子器件中的钨钼等材料,一般用电阻焊已不能满足要求,采用激光焊能很好地达到要求,因为激光辐射源能使被焊零件表面具有高的功率密度,能确保高速加热,实现局部焊接的工艺。
With the development of science and technology, especially the rapid development of electronic industry, it is necessary to weld metal with high thermal conductivity and high melting temperature. Widely used in electronic devices such as tungsten and molybdenum materials, the general resistance welding can not meet the requirements, the use of laser welding can well meet the requirements, because the laser welding surface can be welded parts with high power density, to ensure high-speed Heating, to achieve local welding process.