The ever increasing functionality, speed, portability and increased use of the internet in consumer electronics is putting tremendous pressure on designers and manufacturers to pack more circuitry into smaller spaces. An emerging technology assisting designers with this evolution is the move towards embedding passive components into the substrate of the printed wiring board.This presentation will give an overview of the burgeoning development of embedded passive materials. We will discuss embedded planar capacitor layers for power and ground planes to achieve EMI reduction and signal integrity benefits.Two other different broad classes of embedded passives materials currently under development within DuPont Electronic Technologies. One class is called Interra? Polyimide resistor and capacitor printing paste. These materials were applied on PWB by standard printing and curing process. The other class is referred to as Interra? ceramic thick film products and these materials are useful for burying discrete resistors and capacitors within PCBs. Several OEM designs achieving desired results from embedded passive materials and a review of the printed wiring board fabricators ability to adapt processes to accommodate these new technologies will be discussed.