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As leading-edge technology provider, HHNEC progressively developed competitive and mature platforms in NVM, analog/power management and RF technologies.Based on those advanced and special processes in discrete and CMOS, HHNEC is extending its technology advantage to MEMS processing.In this presentation, a MEMS structure of 200 x 200 x 1.5 um poly-membrane over cavity was successfully demonstrated on 200mm wafers with HHNEC current tool settings and special processes of deep Si-etch and low-stress ploy.All adopted process steps in the flow are compatible with HHNEC CMOS technology.HHNEC will continue developing CMOS compatible MEMS processing for pressure and inertia sensor, RF and other applications.