以粗糙铜箔为基底,采用一步电沉积法获得Cu-Sn合金,X射线衍射(XRD)测试结果显示其主要为Cu6Sn5合金相.扫描电子显微镜(SEM)测试结......

以氢气泡为动力学模板电沉积获得多孔铜,并通过热处理增强其结构稳定性.进一步将多孔铜作为基底通过电沉积制备Cu-Sn合金负极.XRD......

By means of adding low content of rare earth element La into Sn6(bPb40 solder alloy, the growth of Cu6Sn5 intermetallic ......