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[期刊论文] 作者：Zhang Jian-Min,Xu Ke-Wei,
来源：中国物理（英文版） 年份：2005
X-ray diffraction is used extensively to determine the residual stress in bulk or thin film materials on the assumptions that the material is composed of fine c...
[期刊论文] 作者：Zhang Jian-Min,Zhang Yan,Xu Ke-Wei,
来源：中国物理（英文版） 年份：2005
Inteal stress and yield strength of pure copper films on substrates were characterized by x-ray diffraction and thermal-cycle substrate curvature methods. The i...
[期刊论文] 作者：Zhang Jian-Min,Zhang Yan,Xu Ke-Wei,
来源：中国物理（英文版） 年份：2005
Most thin films have different thermal expansion coefficients from their substrates, thus thermal stresses will be introduced into the films when the temperatur...
[期刊论文] 作者：HUANG Jian,XU Ke-Wei,YAO You-s,
来源：中华医学杂志（英文版） 年份：2005
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[期刊论文] 作者：Zhang Jian-Min,Wei Xiu-Mei,Xin Hong,Xu Ke-Wei,
来源：中国物理（英文版） 年份：2005
Unrelaxed energies for Cu (001) twist grain boundaries (GBs) are calculated using a Modified Analytical Embedded Atom Method (MAEAM). The results show that, exc...
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