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Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during So
[期刊论文] 作者：BI Xiaoyang,HU Xiaowu,LI Yulong,JIANG Xiongxin,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2019
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IMC) of Sn-16Sb/Cu(wt％) solder joints prepared by using dip soldering were investigated. The results show that the major IM......
Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal
[期刊论文] 作者：LAI Yanqing,HU Xiaowu,LI Yulong,JIANG Xiongxin,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2019
The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds (IMCs) layer (η-Cu6Sn5 + e-Cu3Sn) for various soldering time and the influence of Bi......
[期刊论文] 作者：XU Tao,HU Xiaowu,LI Yulong,JIANG Xiongxin,YU Xiao,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2019
The formation and growth behavior of intermetallic compound (IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu (SAC305) solder joint during soldering and aging were investigated.The soldering was perf......
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