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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joi
[期刊论文] 作者：YAN Yanfu YAN Hongxing CHEN Fu,
来源：稀有金属：英文版 年份：2007
有 1 mm~2 的搭接代表性的区域用基于的 Cuparticle 改进 63Sn37Pb 被制作合成焊接并且 63Sn37Pb eutectic 焊接在 solder 关节的 creep 行为上检验应力的影响。结果显示 cre...
The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered
[期刊论文] 作者：Yan Yanfu,Yan Hongxing,Chen Fu,
来源：中国焊接 年份：2004
Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancem...
Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joi
[期刊论文] 作者：YAN Yanfu,YAN Hongxing,CHEN Fu,
来源：稀有金属（英文版） 年份：2004
Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to exami...
[期刊论文] 作者：Tao Yong,Wang Tianmiao,Wei Hongxing,Chen Diansheng,
来源：黑龙江科技信息 年份：2010
本文通过对荣华二采区10...
Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joi
[期刊论文] 作者：YAN Yanfu,YAN Hongxing,CHEN Fuxiao,ZHANG Keke,ZHU Jinhong,
来源：稀有金属（英文版） 年份：2007
Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to exami...
Improving the Anti-Toxin Abilities of the CMG2-Fc Fusion Protein with the Aid of Computational Desig
[会议论文] 作者：Yongyi Xi,Xiaojie Wu,Lihua Gao,Yong Shao,Hui Peng,Hongxing Chen,Huipeng Chen,Xianwen Hu,Junjie Yue,
来源：第七届国际分子模拟与信息技术应用学术会议 年份：2014
CMG2-Fc is a fusion protein composed of the extracellular domain of capillary morphogenesis protein 2 (CMG2) and the Fc region of human immunoglobulin G;CMG2-Fc neutralizes anthrax toxin and offers pr...
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