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Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during So
[期刊论文] 作者：BI Xiaoyang,HU Xiaowu,LI Yulong,JIANG Xiongxin,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2019
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IMC) of Sn-16Sb/Cu(wt％) solder joints prepared by using dip soldering were investigated. The results show that the major IM......
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