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Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subje
[期刊论文] 作者：M.Nasir Bashir,A.S.M.A.Haseeb,Abu Zayed Mohammad Saliqur Rahman,M.A.Fazal,,
来源：Journal of Materials Science & Technology 年份：2016
Rapid Cu diffusion is one of the main causes of electromigration(EM) failure in lead-free solder joints.In this study, an effort has been made to investigate th...
[会议论文] 作者：Abu Zayed Mohammad Saliqur Rahman,Xingzhong Cao,Peng Zhang,Zhuoxin Li,Runsheng Yu,Baoyi Wang,Long Wei,
来源：第十一届全国正电子湮没谱学会议 年份：2012
Single crystals of α-Al2O3 were irradiated with reactor neutron and high energy electrons (1.9 GeV).Positron annihilation lifetime (PAL),coincidence Dopple...
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