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通过材料的热-力循环实验及数字图像相关(DIC)测量方法来系统研究Ni Ti记忆合金的热瞬态行为,得到不同恒应力水平下及不同温度变化率下的热瞬态响应。根据得到的实验结果,系统分析了温度诱发马氏体相变中的马氏体带演化出现的原因、演化规律以及临界相变应力与温度的关系,揭示了Ni Ti记忆合金的热瞬态相变及变形演化与所在的应力状态及温度变化速率的密切关系,为Ni Ti记忆合金的热瞬态过程的有限元多尺度模拟提供重要的参考。
The thermal transient behavior of Ni Ti memory alloy was systematically investigated by thermal-mechanical cycling experiments and digital image correlation (DIC) measurements. The thermal transient response under different levels of constant stress and different temperature rates was obtained. Based on the experimental results obtained, the causes of the evolution of martensite band, the evolution law and the relationship between the critical phase transformation stress and temperature in the temperature-induced martensitic transformation were systematically analyzed. The thermal transient phase The close relationship between deformation, deformation and stress state and temperature change rate provide important references for the multi-scale finite element simulation of thermal transient of Ni Ti memory alloy.