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为了探寻准分子激光电化学刻蚀硅工艺中的热—力效应特性,采用功率密度大的248nm准分子激光聚焦照射浸在KOH溶液中的n-Si表面,实现了一种激光电化学复合刻蚀工艺。通过数值仿真与实验比较的方法,对该工艺的刻蚀速率进行了分析。研究结果表明,该复合工艺存在激光直接刻蚀、电化学刻蚀和激光与电化学耦合刻蚀等三种刻蚀作用;在耦合作用中,溶液中激光加工的热效应较小,光热效应导致的刻蚀小;而溶液中激光加工的力学效应对材料的刻蚀作用很大。通过对准分子激光与溶液中靶材相互作用过程的热—力效应分析,更深入地探讨了准分子激光电化学工艺的刻蚀机理。
In order to explore the thermo-force effect in excimer laser electrochemical etching of silicon, a 248nm excimer laser with high power density was used to focus the n-Si surface immersed in KOH solution to achieve a laser electrochemical composite etching Erosion process. Through the numerical simulation and experimental comparison method, the etching rate of the process was analyzed. The results show that there are three kinds of etching processes such as laser direct etching, electrochemical etching and laser-electrochemical coupling etching. In the coupling process, the thermal effect of laser processing in solution is small and the photothermal effect Etching small; and laser processing in solution mechanics effect on the etching of the material. By analyzing the thermo - force effect of the interaction between the molecular laser and the target in the solution, the etching mechanism of the excimer laser electrochemical process is discussed in more depth.