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采用离子交换法去除ULSI/GLSI CMP浆料SiO2水溶胶中的Na+。介绍了微电子专用CMP SiO2水溶胶纯化的研究现状。实验分析了SiO2水溶胶中Na+与阳离子树脂的交换机理,硅溶胶中Na+去除分为硅溶胶溶液中Na+的去除和被硅溶胶胶团吸附Na+的去除。在交换动态平衡时,动态交换1 h较静态交换24 h生产效率提高了20多倍。同时阳1-阳1、阳2-阳1、阳3-阳1、阳1-阴1-阳1等离子交换工艺均能得到很好的纯化效果CNa+<5×10-6,不仅循环利用了树脂,而且酸碱耗量减少了50%以上。同时纯化硅溶胶配成碱性抛光液在硅片CMP应用中取得良好的结果。
Removal of Na + from ULSI / GLSI CMP slurry SiO2 hydrosols by ion exchange method. The research status of CMP SiO2 hydrosol purification for microelectronics is introduced. The exchange mechanism between Na + and cationic resin in SiO2 hydrosol was analyzed experimentally. The removal of Na + in silica sol was divided into the removal of Na + in silica sol and the removal of Na + by silica sol. When exchanging the dynamic equilibrium, the dynamic efficiency of exchange for 1 h is more than 20 times higher than the static exchange for 24 h. At the same time, positive 1-positive 1, positive 2-positive 1, positive 3-positive 1, positive 1-negative 1-positive 1 plasma exchange process can be very good purification effect CNa + <5 × 10-6, not only recycled Resin, and acid-base consumption decreased by 50% or more. At the same time purification of silica sol dubbed alkaline polishing solution in the silicon CMP application achieved good results.