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研究等通道转角挤压(ECAP)及后续加热到半固态温度对7075铝合金显微组织的影响。7075铝合金的显微组织受ECAP道次、ECAP路径、后续加热温度和保温时间等参数的影响。采用实验及Taguchi法探讨上述参数对7075铝合金的微观特性包括晶粒尺寸及形状因子的影响。结果表明:5道次ECAP、路径BA及后续630°C等温处理15 min是合金获得半固态显微组织的较佳工艺条件;加工路径和保温时间对晶粒尺寸的影响最大,而ECAP道次和加热温度对晶粒尺寸的影响最小。形状因子受加工路径、保温时间和加热温度的影响较大,而受ECAP道次的影响较小。
The effects of ECAP and subsequent heating to semi-solid temperature on the microstructure of 7075 aluminum alloy were investigated. The microstructure of 7075 aluminum alloy is affected by parameters such as ECAP pass, ECAP path, subsequent heating temperature and holding time. The experimental and Taguchi methods were used to investigate the influence of the above parameters on the microstructure characteristics of 7075 aluminum alloy including grain size and shape factor. The results show that the 5-pass ECAP, the path BA and subsequent isothermal treatment at 630 ° C for 15 min are the better technological conditions for obtaining the semi-solid microstructure of the alloy. The processing path and holding time have the greatest effect on the grain size, while ECAP And the heating temperature on the smallest grain size. The shape factor is greatly influenced by processing route, holding time and heating temperature, but less affected by ECAP pass.