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以丙烯酸酯/酰胺类单体为原料,采用喷墨打印技术分别将单体与荧光染料溶液打印到载玻片上,经紫外光引发进行原位聚合制得包载荧光共轭聚合物的聚合物微阵列芯片。采用高通量筛选法对聚合物微点的荧光强度进行研究,从而获得能使荧光强度增强或淬灭的共聚物。再采用反相悬浮聚合法将筛选出的聚合物制备成微球,通过红外、扫描电镜、热失重及荧光光谱对其进行结构、热稳定性能及荧光特性的表征。研究表明,甲基丙烯酸羟乙酯(HEMA)/乙二醇二甲基丙烯酸酯(EGMA)(HEMA/EGMA,质量配合比为5∶15)包载荧光染料后,在400℃时,失重率为45%;在25℃时,相对荧光强度达到42cd,热稳定性和光稳定性都得到了提高。
Using acrylate / amide monomers as raw materials, the monomer and the fluorescent dye solution were printed onto the glass slides by inkjet printing technique respectively and polymerized by in situ polymerization initiated by UV light to obtain polymer containing fluorescent conjugated polymer Microarray chip. The fluorescence intensity of polymer micro-dots was studied by high-throughput screening method, so as to obtain the copolymer which can enhance or quench the fluorescence intensity. Then, the selected polymers were prepared into microspheres by reversed-phase suspension polymerization. Their structures, thermal stability and fluorescence properties were characterized by infrared, scanning electron microscopy, thermogravimetry and fluorescence spectroscopy. The results showed that after 400 ℃, the weight loss rate of HEMA / EGMA (HEMA / EGMA, mass ratio 5:15) 45%; at 25 ℃, the relative fluorescence intensity reached 42cd, the thermal stability and light stability have been improved.