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使用电化学阻抗(EIS)、X射线光电子能谱(XPS)和扫描电子显微镜(SEM)等手段,研究了纯铜在不同p H值模拟酸雨溶液中的腐蚀行为。结果表明,在不同p H值的模拟酸雨溶液中纯铜的阻抗谱特征有很大差异,说明纯铜有不同的腐蚀机制。XPS分析结果表明,在模拟酸雨溶液的p H值为3时纯铜表面主要生成Cu2O,p H值为5时表面主要生成Cu O,p H值为6时表面生成Cu2O和Cu O的混合物。O2和H+共同影响纯铜的腐蚀历程,在低p H值环境中腐蚀的控制步骤是溶解氧通过双电层的扩散,H+的存在起促进作用。随着p H值的升高H+的促进作用逐渐减弱,纯铜的腐蚀主要受氧的去极化过程控制。
The corrosion behavior of pure copper in different p H simulated acid rain solutions was investigated by means of electrochemical impedance spectroscopy (EIS), X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The results show that there are great differences in the impedance spectra of pure copper in simulated acid rain solutions with different p H values, indicating that copper has different corrosion mechanisms. The results of XPS analysis show that Cu2O is mainly formed on the pure copper surface when the p H value of the simulated acid rain solution is 3, and Cu O is mainly formed on the surface when the p H value is 5, and the mixture of Cu2O and Cu O is formed on the surface when the p H value is 6. O2 and H + affect the corrosion process of pure copper together. The control step of corrosion in low p H environment is the diffusion of dissolved oxygen through the electric double layer, and the existence of H + can promote it. With the increase of p H value, the promotion effect of H + gradually weakened. The corrosion of pure copper was mainly controlled by the depolarization process of oxygen.