由信息产业部包装办公室主办的“全国电子信息产品包装研讨会暨采购洽谈会”将于2004年4月23日至25日在上海国际包装·印刷城隆重召开。这次会议的主题是:电子信息工业产品包装现状和发展趋势、蜂窝纸板、纸浆模塑、竹胶合板等环保包装材料在电子信息工业产品包装上的应用、家 The “National Electronic Information Product Packaging Symposium and Procurement Fair” hosted by the Packaging Office of the Ministry of Information Industry will be held in Shanghai International Packaging and Printing City from April 23 to April 25, 2004. The theme of this conference is: the current situation and development trend of electronic information industrial product packaging, the application of environmental protection packaging materials such as honeycomb paperboard, pulp molding and bamboo plywood in the electronic information industrial product packaging, home