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探讨了热压压力、热压温度以及热压次数对对位芳纶纸强度性能的影响,并利用扫描电镜对热压前后的纸张结构进行观察。结果表明:与芳纶原纸相比,热压后对位芳纶纸的紧度、抗张指数和撕裂指数显著提高,但随热压工艺参数的变化有不同的规律。固定热压温度为160℃,在热压压力为2~5MPa的范围内提高压力,紧度和抗张指数增加不明显,而撕裂指数有下降趋势;固定热压压力为2MPa,在温度120~180℃范围内提高温度,紧度增加幅度不大,而抗张指数和撕裂指数则随温度的升高呈现出先升高后降低的趋势,在温度为140℃时达最大值。较佳的热压工艺为:热压压力2MPa、热压温度140℃、热压次数5次,此时纸张的抗张指数和撕裂指数分别为43.8N.m/g和30.9 mN.m2/g。
The effects of hot pressing pressure, hot pressing temperature and pressing times on the strength properties of para-aramid paper were discussed. The paper structure before and after hot pressing was observed by SEM. The results show that the tensile strength, tensile index and tear index of para-aramid paper after hot pressing are significantly higher than those of aramid paper. However, there are different rules with the variation of hot pressing process parameters. Fixed hot pressing temperature is 160 ℃, hot pressing pressure is 2 ~ 5MPa range to increase the pressure, the tightness and tensile index increase is not obvious, while the tear index has a downward trend; fixed hot pressing pressure of 2MPa, at a temperature of 120 ~ 180 ℃, the increase of tensile strength is small, while the tensile and tear indexes increase first and then decrease with the increase of temperature, reaching the maximum at 140 ℃. The hot pressing process is as follows: the hot pressing pressure is 2MPa, the hot pressing temperature is 140 ℃, the number of hot pressing is 5 times, and the tensile index and tear index of the paper are 43.8N.m / g and 30.9 mN.m2 / g respectively at this time.