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本文采用双源共蒸的方法,在室温、100℃和160℃的NaCl衬底上,制备了不同组分的CuC60颗粒膜并在160℃对样品进行了退火研究,结果表明样品的热稳定性较好,退火对样品的微结构影响不显著,这可以由金属铜和C60之间的强的互作用来解释。样品的TEM和AFM形貌和结构研究表明,薄膜的颗粒度大小与沉积温度及沉积速率和金属C60相对组分有关。
In this paper, CuC60 particles with different compositions were prepared on the NaCl substrate at room temperature, 100 ℃ and 160 ℃ using double-source co-evaporation. The samples were annealed at 160 ℃. The results showed that the thermal stability Preferably, the microstructural effect of the anneal on the sample is insignificant, which can be explained by the strong interaction between the metallic copper and the C60. TEM and AFM morphology and structure of the sample showed that the size of the film particle size and deposition temperature and deposition rate and the relative composition of the metal C60.