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为了防止芯片过热,提高芯片可靠性和稳定性,提出了一种改进的高精度、低功耗、具有迟滞功能且结构简单的过温保护电路。在不引入热振荡的前提下,实现稳定电路温度和输出关断信号的双重功能。阐述了过温保护电路的工作原理,基于先锋国际半导体公司的BiCMOS0.5μm工艺库模型进行电路设计,采用Hspice软件并用先锋国际半导体公司的BiCMOS 0.5μm工艺库模型对该电路进行模拟仿真。仿真结果表明:当外界温度达到137℃时,过温保护电路输出发生翻转,从而关断芯片内的其他电路,降低功耗,使温度降低。当温度降到120℃时,芯片回到正常工作状态,温度迟滞量为17℃,性能稳定可靠。
In order to prevent overheating of the chip and improve the reliability and stability of the chip, an improved over-temperature protection circuit with high accuracy, low power consumption, hysteresis and simple structure is proposed. In the introduction of thermal oscillation under the premise of achieving a stable circuit temperature and output shutdown signal dual functions. The working principle of the over temperature protection circuit is described. The circuit design is based on the BiCMOS0.5μm technology library model from Pioneer International Semiconductor Corporation. The circuit is simulated by Hspice software and the BiCMOS 0.5μm technology library model from Pioneer International Semiconductor Corporation. The simulation results show that when the outside temperature reaches 137 ℃, the overtemperature protection circuit output is turned over, thus turning off other circuits in the chip to reduce the power consumption and lower the temperature. When the temperature dropped to 120 ℃, the chip returned to normal working condition, the temperature hysteresis is 17 ℃, the performance is stable and reliable.